Motek 2019 at the Starting Line: Modern, Pragmatic, Process-Oriented

The 38th Motek international trade fair for automation in production and assembly will open its doors in Stuttgart from the 7th through the 10th of October, 2019 A well-received, “must-attend” event for all design engineers, users and production managers who are looking for practical solutions for industrial manufacturing and assembly. Motek presents the entire spectrum of rapidly changing process automation – it’s the number one process sequence trade fair!

Trade fair promoters P. E. Schall GmbH & Co. KG are planning the Motek in an application and practice-oriented manner on the basis of established principles and are flanking the industry event for the 13th time with the Bondexpo international trade fair for bonding technology. Design engineers and users will find basic systems, details and components at Motek, as well as interdisciplinary approaches, interlinked and networked systems along with software and industrial communication. The trade fair is a mirror image of industrial manufacturing practice which is undergoing highly dynamic change. At no other trade fair are expert visitors able to gain such a comprehensive overview of current products and systems covering all aspects of automation in industrial production and assembly.

 

Presentation of the Manufacturing Process from Start to Finish

Expert visitors can successively work their way through the various issues of production and assembly automation beginning with receiving and including all process steps such as quality assurance, identification, packaging, order picking and intra-logistics – or address a single specific issue in a targeted fashion. The thematic structure which is consistently aligned to daily manufacturing routine provides exhibitors and expert visitors alike with quick orientation and minimal legwork. Assembly systems, handling technology, robots, joining and screwing technology, material flow and conveyor systems, measuring and test technology are presented to the trade fair guest as well as drives, controllers, sensors and software. But products and systems are no longer seen as entities unto themselves – expert visitors are interested in the manufacturing process as an overall system within the framework of advancing, consistent digitalisation of automation functions. They’re looking for turnkey system solutions for modern production and find answers at Motek to all of the questions which arise on their way to the smart factory.

 

Digitalisation and Virtualisation

Digitalisation is neither a buzzword nor a marketing instrument at Motek, but rather genuine content because networking, big data, artificial intelligence and the Internet of Things have long since arrived at many industrial manufacturing companies – lots of expert visitors will have open questions in this regard, to which they’ll find practical answers at Motek. Issues such as software for systems planning, digital twins, virtual reality, data security and digital services will be provided with a platform at the booths of many of the exhibitors, as well as within the framework of special shows and expert forums.

 

Robotics and Handling Technology

Numerous renowned exhibitors from the fields of robotics and handling systems align themselves to the Motek-Bondexpo trade fair duo. These key issues are very well prepared for expert visitors at Motek – great demand for robotics and automation continues unbroken, human-machine collaboration is becoming daily routine to an ever greater extent and the associated issue of safety is more current than ever.

Seven months before the industry event opens, Motek project manager Rainer Bachert from trade fair promoters P.E. Schall GmbH & Co KG has his work cut out for him with bookings and booth allocation. The trade fair team is expecting roughly 1000 exhibitors on 63,000 square metres of exhibition floor space. Assembly automation enthusiasts can keep themselves up to date via Facebook, Instagram, YouTube and of course the trade fair website at www.Motek-Messe.de.