Motek and Bondexpo Supplement Each Other Perfectly

Powerful Schall Trade Fair Duo on the Starting Line Again

The 37th Motek international trade fair for automation in production and assembly and the 12th Bondexpo international trade fair for bonding technologies will take place at the Stuttgart Exhibition Centre from the 8th through the 11th of October, 2018. The world’s largest offerings for solutions in the field of assembly automation will be showcased here.


Motek Presents the Market: Including Tomorrow’s Issues

In 2017, the fields of robotics and automation achieved record-breaking sales in Germany amounting to €14.5 billion – 13% more than in the previous year. The VDMA (German Mechanical Engineering Industry Association) is predicting 9% growth for the industry sector in 2018 for a total of €15.8 billion. Whether human-robot interaction, digital transformation in manufacturing or assembly with flexible variants and quantities is concerned, as a globally leading trade fair, Motek points out the direction in which the trends are moving in the field of automation in production and assembly! And this of course means more than just scratching the surface of future issues such as HRI and I 4.0, but rather thinking them through to the end and presenting them tangibly in the form of practical solutions.


Broad-Ranging Scope of Assembly Automation

From traditional, semi-automated assembly right on up to fully automated, robot-aided production or assembly systems – there’s a broad ranging scope of requirements and applications and, since production in the future will become more and more closely networked with the virtual data world, handling equipment and robots will have to be equipped with more and more new capabilities. Machine learning is the key word in this respect. Easy-to-operate, flexible systems whose functions can be changed without time-consuming programming aren’t only interesting for established, large-scale users, but rather for small and mid-sized companies as well, for example who are thus able to take advantage of automation without specially qualified personnel. But how do machines, robots and systems work and communicate with each other and the control system? The trade fair in Stuttgart will also present solutions for interface optimisation, bus systems and all aspects of the OPC UA communication standard to this end, which will provide smart factories with decisive thrust in the months and years to come.


Supplementary Offerings: Bondexpo – Modern Joining Technologies for Lightweight Design

Modern joining technologies must not be short changed as a supplement to the leading assembly trade fair. Where lightweight assembly is concerned, there’s no match for the concurrently held Bondexpo: How components and modules made of high-tech plastics and CFRP, as well as hybrid and composite materials, are efficiently assembled with top quality results is explored in all of its facets at the complementary event. “Bondexpo is the ideal supplement for Motek because it presents innovative bonding solutions for assembly tasks”, says project manager Rainer Bachert. And top specialists are required in the field of bonding technology in order to develop the right chemical formulation and appropriate dosing for the respective application and the materials to be bonded.


Practice-Oriented Supplementary Program for Mid-Sized Companies As Well

Human-robot interaction will support flexible production with small lot quantities and high levels of complexity in the future. The issue of safety at the interface between people and machines won’t be neglected at Motek and Bondexpo: the expert forum on “Safety + Automation” will be held for the second time this year, which was launched with great success in 2017. It will be organised by collaboration partner PILZ. Numerous highly practical presentations will deal with Safety Architecture 4.0, occupational safety legislation, CE processes and safe human-robot interaction.