Smart Solutions for Production and Assembly: This is once again the motto for the 39th Motek international trade fair for automation in production and assembly which, together with the 14th Bondexpo international trade fair for bonding technology, is gearing up for its appearance in Stuttgart from the 5th through the 8th of October, 2020. Special emphasis will be placed on the issues of digitalisation and connectivity.
As the leading trade fair in the field of automation, the well-established annual industry event comprising Motek and Bondexpo is being awaited with special anticipation this year. In particular in times of restrictive economic conditions, industrial users are looking for automation solutions that can be implemented in actual practice in order to be able to efficiently, economically and sustainably implement their respective production tasks. Ultramodern components, modules, subsystems and complete machines for automated production and assembly are at the heart of the product and services portfolio of the internationally recognised information, communication and business platform. Motek will present complete solutions with networked technology and communication which are geared to actual industrial practice for consistently automated production with flexible lot quantities.
It’s a well-known fact that Motek is indelibly marked in the calendars of many companies and firmly established as the strongest and most important trade fair with international character. Exhibitors and expert visitors alike regard it highly as an ideal platform for presenting technological innovations and discussing application-specific solutions for present and future production. Highly practical topics and their interlacing with each other, as well as realistic process flows, which can’t be found anywhere else in such an all-embracing format are presented to the expert visitors at the Motek/Bondexpo trade fair duo.
Arena of Integration: Digitalisation Implemented in Concrete Terms
Motek/Bondexpo 2020 will once again be flanked by the integrative AoL theme park (Arena of Integration). Participating companies underscore their worldwide importance by developing practically feasible solutions in collaboration with automation partners for everyday industrial use for customers and users. On the one hand, connectivity is put into actual practice by means of cooperation, and on the other hand tangible, marketable results are obtained. Trade fair promoters P. E. Schall GmbH & Co. KG are taking the issue of digitalisation out of the theoretical corner and moving it directly into practical application with the AoI concept.
Bondexpo 2020: Platform for New Developments and Basic Technologies Gearing Up for the Future
Joining technology is an essential constituent of industrial manufacturing. And this is why the time-tested annual trade fair duo – comprised of Motek and the complementary Bondexpo event – has established itself as a coveted meeting place for the industry sector. Nowhere else are trade fair visitors from industrial practice offered such an extensive range of issues, making it possible for them to gain a comprehensive overview of how modern, economically efficient production processes have to be set up. Bondexpo provides modern bonding, joining and fastening technologies with a worthy industry event. All processes with relevance for bonding, joining and fastening technologies are presented here in the form of integratable products and services as subsystems or complete systems. Adhesives are becoming increasingly important for industrial production. Expert visitors can experience all the latest innovations and developments in joining and bonding technology – in a compact format in a single exhibition hall. “Bondexpo is one of the year’s most important trade fairs for us, because we meet up with precisely the right target group for our company at a single location,” explains Andrea Werkmann, marketing manager at relyon plasma GmbH in Regensburg. “Not only do we meet our customers here, but above all a broad-based professional audience interested in innovative ideas.” Andrea Werkmann confirms that Bondexpo is of great value to expert visitors, because the entire industry gets together at the event: “Expert visitors can gain a broad overview of new developments as well as basic technologies, all at a single location.”