13. June 2023

Motek/Bondexpo 2023: Distinct Profile, Key Topics

Motek Internationale Fachmesse für Produktions- und Montageautomatisierung 52A0116 SCHALL Motek 3000 scaled uai

It’s “Motek Time” again in October: the traditional Motek/Bondexpo trade fair duo is once again extending its invitation to Stuttgart from the 10th through the 13th of October, 2023. Together with the 16th Bondexpo international trade fair for bonding technology, the 41st Motek international trade fair for automation in production and assembly focuses on production as an overall system. With a distinct profile, the trade fair duo deals with key topics in its customary, pragmatic working atmosphere.

Current and future challenges for economy and society necessitate practicable, implementable solutions for manufacturing companies. This is why the Motek/Bondexpo trade fair duo is sticking to its proven concept, which has been successful for decades, and is emphasising pragmatic, feasible systems. With its distinct profile, the trade fair provides investment decision-makers, purchasing agents and design engineers with everything they need to improve their production processes and make them more economical: Motek/Bondexpo covers the entire process sequence for economical production and assembly automation – from components and modules, right on up to subsystems and complete solutions.

The Concept: Highly Practical, Thematically Focused and Reliable

Together with the fully integrated Bondexpo trade fair, Motek takes a holistic view of manufacturing processes – from the component level all the way up to the overall system. For decades, production companies from various sectors have come to value the pragmatic, practical relevance and reliable thematic positioning of Motek/Bondexpo. The trade fair focuses on three cornerstones including “networked, smart production components”, “assembly assistance systems” and “solutions for easy implementation and commissioning”.

Networked production components have been subject to intensive further development in all directions for years, and have since acquired “smart” properties thanks to progressive digitalisation, advanced sensor technology and improved image processing: grippers, tool holders, handling systems and solutions, screwdriving and linear technologies, as well as drives and feed components capture status information directly at the process and transmit data in real time. As a result, system and process conditions can be directly detected and optimised, and imminent failures can be foreseen and avoided as well. All in all, networked production components contribute significantly to process optimisation, the conservation of resources and economic efficiency.

Assembly and assembly assistance systems are also becoming increasingly “intelligent”. Assistance systems for manual and semi-automatic workstations, as well as assisted picking solutions, are traditionally amongst the key issues covered at Motek/Bondexpo. For example, significant further developments in automated bin picking will be presented, along with assisted assembly processes with co-working cobots – e.g. for automated parts supply and discharge.

Thanks to advancing digitalisation, automation and software development, Motek/Bondexpo will also showcase new solutions for easy implementation and commissioning of systems. Amongst other aspects, these include system simulation by means of digital twins, as well as easy-to-implement plug-and-play solutions and starter kits. “Automation in the manufacturing industry should be simple and easily implementable, and it should also be accessible to small and mid-sized companies,” stresses Rainer Bachert, Motek/Bondexpo project manager at trade fair promoters P. E. Schall. “As an annual autumn trade fair highlight, Motek/Bondexpo is the right platform for a personal exchange of technical knowledge thanks to its clear-cut thematic profile,” continues Bachert. “Efficiency, sustainability and flexibility are at the top of the agenda for suppliers and users in order to maintain economic success. Smart, networked products for feeding, handling and assembly are essential success parameters for production in this regard.”

Motek/Bondexpo: Automation Intelligence for Production and Assembly

The trade fair concept – the representation of complete processes in industrial manufacturing – provides companies from all sectors with suitable approaches for getting started easily with the automation and digitalisation of products and processes. This includes ergonomic and age-appropriate workstations as well as robotics, software-supported workflows and the integration of AI-supported processes. The goal is to simplify and optimise all processes in order to meet the challenges of reduced energy consumption, the conservation of resources and sustainability. And thus Motek/Bondexpo unites pragmatism, practicality and future viability.

“We’re looking forward to welcoming the expert community to Motek/Bondexpo 2023 once again this fall,” says Bettina Schall, managing director of trade fair promoters P. E. Schall. “A personal dialogue between suppliers and users at the expert level is indispensable for technological progress. That’s why Motek/Bondexpo will once again be a popular meeting place for the industry this autumn, where decision-makers can successfully advance their plans.” Exhibitors and expert visitors are looking forward to the trade fair highlight for modern production automation in Stuttgart from the 10th through the 13th of October, 2023.

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61 Years of Trade Fairs for Markets – Schall Trade Fairs’ Recipe for Success

Schall has developed successful business platforms with internationally recognised trade fairs for quality assurance (Control), optical technologies, components and systems (Optatec), stamping technology (Stanztec), automation in production and assembly (Motek), bonding technology (Bondexpo), plastics processing (Fakuma), sheet metal working (Blechexpo) and joining technology (Schweisstec). This has given rise to entirely new markets in various sectors, whose protagonists are distinguished by tremendous innovative strength, comprehensive systems competence and practical application solutions.